AGENDA - PACKAGING: COST EFFECTIVE EMC DESIGN

This one-day short course on packaging and interconnection is oriented toward Mechanical/Packaging Engineers and includes design information from the EMC Systems Design Engineering short course as well as additional material on Cabling, Filtering, ESD, and Electro-Galvanic Compatibility. The packaging discussion covers systems level shielding (with an emphasis on the more cost effective PCB compartmentalized shielding), and includes aperture controls as well as mechanical and corrosion design. Shielding is especially valuable because it is the only global suppression technique that can be applied to a system without impacting signal integrity.

1. OVERVIEW OF EMI/RFI/EMC PROBLEM

  • Examples of Interference Conditions
  • Interference Sources
  • Interference Receptors
  • F.A.S.T. Analysis
  • Systems Emission/Immunity

    • 2. SYSTEMS DESIGN

  • Conducted vs Radiated Emission
  • Simplified Circuit Loop Radiation Equation
  • Maximum Loop Area to meet emission limits
  • Simplified Circuit Loop Pickup Equation
  • Design Emphasis
  • Spectrum Density vs Pulse Shape

    • 3. CABLE DESIGN PRACTICES

  • Cables: Systems Antennas
  • Differential Mode Currents
  • Common Mode Currents
  • Twisted Pair
  • Cable Shielding
  • Shield Grounding
  • Pigtails and Daisy Chains
  • Ribbon Cables
  • Coaxial Cables
  • Connectors
  • Crosstalk/Termination

    • 4. FILTER SELECTION/INSTALLATION

  • Popular Filter Types
  • Attenuation vs Frequency
  • Source and Load Impedance
  • Butterworth Low-Pass Filter
  • Inrush Current
  • Filter Mounting & I/O Isolation
  • Filter Grounding
  • Ferrite Bead Attenuation

    • 5. ELECTROSTATIC DISCHARGE (ESD)

  • Electron Mobility and Charge Creation
  • Mechanism of ESD
  • ESD Coupling into Electronic Systems
  • Radial and Linear Current Flow
  • Direct & Indirect Discharge
  • Circuit/Cabling Hardening
  • ESD Shielding - Conductive Enclosures
  • ESD Shielding - Plastic Enclosures
  • ESD Test and Evaluation

    • 6. PCB/EQUIPMENT SHIELDING

  • Near Field/Far Field
  • Containment/Exclusion
  • Shielding characteristics
  • Graphical representation
  • Absorption and Reflection equations
  • Shielding Effectiveness vs Frequency
  • PCB/Equipment shielding compromises
  • Aperture Integrity
  • Waveguide Below Cutoff
  • Window and vent panels
  • Plastic Base Materials

    • 7. RF GASKETS

  • Seam design and the four most popular configurations
  • High performance enclosures seams
  • Card cage shielding
  • Mechanical/Electrical Considerations
  • Qualitative Shielding Effectiveness

    • 8. ELECTRO-GALVANIC COMPATIBILITY

  • Corrosion Induced EMC Failures
  • Conditions Necessary for Corrosion
  • Galvanic Potentials and Coupling
  • Shielded Enclosure Seams
  • Oxidation/Reduction Reaction
  • Preventing Corrosion
  • Protection Requirements

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